Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.650" (16.51mm), Amplada: 0.650" (16.51mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-247, TO-264, Mètode d’adjunt: Clip, Solder Foot, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 0.710" (18.03mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Fins, Llargada: 2.165" (55.00mm), Amplada: 2.165" (55.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.850" (21.59mm), Amplada: 0.850" (21.59mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Angled Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Fins, Llargada: 1.870" (47.50mm), Amplada: 1.870" (47.50mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Fins, Llargada: 1.969" (50.00mm), Amplada: 1.969" (50.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Clip, Solder Foot, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 0.710" (18.03mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Clip, Solder Foot, Forma: Rectangular, Fins, Llargada: 2.953" (75.00mm), Amplada: 0.710" (18.03mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Angled Fins, Llargada: 1.673" (42.50mm), Amplada: 1.673" (42.50mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, TO-247, Mètode d’adjunt: Solderable Feet, Forma: Rectangular, Fins, Llargada: 0.803" (20.40mm), Amplada: 1.339" (34.00mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Angled Fins, Llargada: 0.906" (23.00mm), Amplada: 0.906" (23.00mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Square, Angled Fins, Llargada: 1.339" (34.00mm), Amplada: 1.339" (34.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, TO-247, TO-264, Mètode d’adjunt: Clip, Solder Foot, Forma: Rectangular, Fins, Llargada: 1.181' (360.00mm), Amplada: 1.063" (27.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, TO-247, TO-264, Mètode d’adjunt: Clip, Solder Foot, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 1.339" (34.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.650" (16.51mm), Amplada: 0.650" (16.51mm),