Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.100" (27.94mm), Amplada: 1.100" (27.94mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.600" (40.64mm), Amplada: 1.600" (40.64mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.827" (21.00mm), Amplada: 0.827" (21.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.750" (44.45mm), Amplada: 1.700" (43.18mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.650" (41.91mm), Amplada: 1.000" (25.40mm),
Tipus: Top Mount, Paquet refrigerat: 14-DIP and 16-DIP, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Rectangular, Fins, Llargada: 0.750" (19.05mm), Amplada: 0.415" (10.54mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.100" (27.94mm), Amplada: 1.100" (27.94mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-218, TO-220, TO-247, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.000" (25.40mm), Amplada: 1.650" (41.91mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, TO-218, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.000" (25.40mm), Amplada: 0.640" (16.26mm),