Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Cylindrical,
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Solder Anchor, Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.906" (23.01mm), Amplada: 0.906" (23.01mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.063" (27.00mm), Amplada: 1.063" (27.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.180" (29.97mm), Amplada: 1.180" (29.97mm),
Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Top Mount, Paquet refrigerat: TO-18, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 5.500" (139.70mm), Amplada: 5.000" (127.00mm),
Tipus: Top Mount, Paquet refrigerat: Raspberry Pi, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Llargada: 0.551" (14.00mm), Amplada: 0.545" (13.84mm),