Dissipadors de calor tèrmics

3-1542011-8

3-1542011-8

Stock Part: 6196

Paquet refrigerat: BGA, Mètode d’adjunt: Clip, Forma: Cylindrical,

374624B00032G

374624B00032G

Stock Part: 4994

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374724B60024G

374724B60024G

Stock Part: 4510

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Solder Anchor, Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374124B00035G

374124B00035G

Stock Part: 4624

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.906" (23.01mm), Amplada: 0.906" (23.01mm),

374424B00035G

374424B00035G

Stock Part: 4622

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.063" (27.00mm), Amplada: 1.063" (27.00mm),

374024B00035G

374024B00035G

Stock Part: 4801

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.906" (23.01mm), Amplada: 0.906" (23.01mm),

374724B00035G

374724B00035G

Stock Part: 5818

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

335824B00034G

335824B00034G

Stock Part: 7060

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.180" (29.97mm), Amplada: 1.180" (29.97mm),

323005B00000G

323005B00000G

Stock Part: 28241

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

311505B00000G

311505B00000G

Stock Part: 58810

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

320205B00000G

320205B00000G

Stock Part: 46688

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

326005B00000G

326005B00000G

Stock Part: 55126

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

322400B00000G

322400B00000G

Stock Part: 43917

Tipus: Top Mount, Paquet refrigerat: TO-18, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

322505B00000G

322505B00000G

Stock Part: 37411

Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

322605B00000G

322605B00000G

Stock Part: 37010

Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

394-2AB

394-2AB

Stock Part: 2788

Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 5.500" (139.70mm), Amplada: 5.000" (127.00mm),

3083

3083

Stock Part: 48876

Tipus: Top Mount, Paquet refrigerat: Raspberry Pi, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Llargada: 0.551" (14.00mm), Amplada: 0.545" (13.84mm),