Dissipadors de calor tèrmics

3-1542006-5

Stock Part: 6915

3-1542002-0

Stock Part: 5823

3-1542002-5

Stock Part: 6235

301M

Stock Part: 3386

302M

Stock Part: 2992

302NN

Stock Part: 2912

302MM

Stock Part: 2796

303MM

Stock Part: 2624

303N

Stock Part: 2821

302N

Stock Part: 3150

395-1AB

Stock Part: 3309

Tipus: Board Level, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 3.000" (76.20mm), Amplada: 5.000" (127.00mm),

392-120AB

Stock Part: 911

Tipus: Top Mount, Paquet refrigerat: Power Modules, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 4.724" (120.00mm), Amplada: 4.921" (124.99mm),

396-1AB

Stock Part: 2814

Tipus: Board Level, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 3.000" (76.20mm), Amplada: 5.000" (127.00mm),

392-300AB

Stock Part: 420

Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 11.811" (300.00mm), Amplada: 4.921" (124.99mm),

396-2AB

Stock Part: 2321

Tipus: Board Level, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 5.500" (139.70mm), Amplada: 5.000" (127.00mm),

392-180AB

Stock Part: 578

Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 7.087" (180.01mm), Amplada: 4.921" (124.99mm),

394-1AB

Stock Part: 3264

Tipus: Top Mount, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 3.000" (76.20mm), Amplada: 5.000" (127.00mm),

395-2AB

Stock Part: 2605

Tipus: Board Level, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 5.500" (139.70mm), Amplada: 5.000" (127.00mm),

342947

Stock Part: 2083

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Rectangular, Fins, Llargada: 2.323" (59.00mm), Amplada: 2.280" (57.91mm),

342942

Stock Part: 3036

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.732" (44.00mm), Amplada: 1.772" (45.00mm),

342948

Stock Part: 1727

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 2.717" (69.00mm), Amplada: 2.756" (70.00mm),

342950

Stock Part: 1438

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 3.543" (90.00mm), Amplada: 3.543" (90.00mm),

342941

Stock Part: 2849

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.594" (40.50mm), Amplada: 1.575" (40.00mm),

342943

Stock Part: 2599

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.969" (50.00mm), Amplada: 1.969" (50.00mm),

342946

Stock Part: 1791

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 2.362" (60.00mm), Amplada: 2.362" (60.00mm),

342949

Stock Part: 1387

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 3.150" (80.00mm), Amplada: 3.150" (80.00mm),

321527B00000G

Stock Part: 8120

Tipus: Top Mount, Paquet refrigerat: TO-5, TO-39, Mètode d’adjunt: Threaded Coupling, Forma: Cylindrical,

374324B00035G

Stock Part: 2363

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.063" (27.00mm), Amplada: 1.063" (27.00mm),

374724B00032G

Stock Part: 2860

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

375024B00032G

Stock Part: 3412

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.01mm),

320105B00000G

Stock Part: 42417

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

374324B60023G

Stock Part: 3997

Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Solder Anchor,

371824B00032G

Stock Part: 4711

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374924B00032G

Stock Part: 4731

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.01mm),

328990006

Stock Part: 47904

Tipus: Top Mount, Mètode d’adjunt: Adhesive, Forma: Square, Fins, Llargada: 0.750" (19.05mm), Amplada: 0.750" (19.05mm),

300872

Stock Part: 6284

Paquet refrigerat: FPGA,