Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Clip, Thermal Material, Forma: Rectangular, Pin Fins, Llargada: 2.895" (73.53mm), Amplada: 2.000" (50.80mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),
