Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 0.655" (16.64mm), Amplada: 0.655" (16.64mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Llargada: 0.790" (20.07mm), Amplada: 0.790" (20.07mm),
Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Bolt On, Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Top Mount, Paquet refrigerat: SMD, Mètode d’adjunt: SMD Pad, Forma: Rectangular, Fins, Llargada: 0.320" (8.13mm), Amplada: 0.900" (22.86mm),
Tipus: Top Mount, Paquet refrigerat: SMD, Mètode d’adjunt: SMD Pad, Forma: Rectangular, Fins, Llargada: 0.500" (12.70mm), Amplada: 1.030" (26.16mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and Clip, Forma: Rectangular, Fins, Llargada: 1.180" (29.97mm), Amplada: 1.000" (25.40mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 0.690" (17.53mm), Amplada: 0.835" (21.21mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.180" (29.97mm), Amplada: 1.000" (25.40mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Press Fit and PC Pin, Forma: Rectangular, Fins, Llargada: 0.750" (19.05mm), Amplada: 0.570" (14.47mm),
Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Bolt On, Forma: Cylindrical, Llargada: 0.557" (14.15mm), Amplada: 0.370" (9.40mm),