Tipus: Board Level, Paquet refrigerat: SMD, Mètode d’adjunt: Push Pin, Forma: Rectangular, Fins, Llargada: 3.181" (80.80mm), Amplada: 4.390" (111.50mm),
Tipus: Board Level, Paquet refrigerat: Pentium® III & Pentium® 4, Mètode d’adjunt: Clip, Forma: Round,
Tipus: Board Level, Paquet refrigerat: Pentium® III & Pentium® 4, Mètode d’adjunt: Clip, Forma: Rectangle, Llargada: 3.740" (95.00mm), Amplada: 3.543" (90.00mm),
Tipus: Board Level, Paquet refrigerat: Pentium® III (Thin), Mètode d’adjunt: Clip, Forma: Rectangle, Llargada: 2.520" (64.00mm), Amplada: 2.000" (50.80mm),
Tipus: Board Level, Paquet refrigerat: Pentium® III & Pentium® 4, Mètode d’adjunt: Clip, Forma: Rectangle, Llargada: 3.740" (95.00mm), Amplada: 3.606" (91.60mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 5.324" (135.23mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 9.240" (234.70mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 7.362" (186.99mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 7.550" (191.77mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Forma: Rectangular, Fins, Llargada: 15.250" (387.35mm), Amplada: 3.980" (101.00mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 8.400" (213.36mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 7.380" (187.45mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 7.875" (200.02mm),
Tipus: Top Mount, Extrusion, Paquet refrigerat: Power Modules, Mètode d’adjunt: Adhesive, Forma: Rectangular, Fins, Llargada: 12.000" (304.80mm), Amplada: 12.250" (311.15mm),
Tipus: Top Mount, Paquet refrigerat: Raspberry Pi, Mètode d’adjunt: Adhesive, Forma: Rectangular, Llargada: 2.205" (56.00mm), Amplada: 0.985" (25.00mm),
Tipus: Top Mount, Paquet refrigerat: Raspberry Pi, Mètode d’adjunt: Adhesive, Forma: Square, Fins,
Tipus: Heat Spreader, Top Mount, Paquet refrigerat: Raspberry Pi,