Tipus: Board Level, Vertical, Paquet refrigerat: SOT-32, TO-220, TOP-3, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 1.359" (34.50mm),
Tipus: Top Mount, Paquet refrigerat: TO-252 (DPak), Mètode d’adjunt: SMD Pad, Forma: Rectangular, Fins, Llargada: 0.320" (8.13mm), Amplada: 0.790" (20.07mm),
Tipus: Top Mount, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 0.472" (12.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 1.181" (30.00mm), Amplada: 1.181" (30.00mm),
Tipus: Top Mount, Paquet refrigerat: 18-DIP, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 0.900" (23.00mm), Amplada: 0.250" (6.35mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.551" (14.00mm), Amplada: 0.551" (14.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Press Fit and PC Pin, Forma: Rectangular, Fins, Llargada: 0.748" (19.00mm), Amplada: 0.504" (12.80mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 0.750" (19.05mm), Amplada: 0.520" (13.21mm),
Tipus: Top Mount, Paquet refrigerat: 6-Dip and 8-Dip, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 0.334" (8.50mm), Amplada: 0.250" (6.35mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Forma: Square, Pin Fins, Llargada: 0.394" (10.00mm), Amplada: 0.394" (10.00mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 0.748" (19.00mm), Amplada: 0.504" (12.80mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Rectangular, Fins, Llargada: 1.378" (35.00mm), Amplada: 0.866" (22.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 0.669" (17.00mm), Amplada: 0.669" (17.00mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 0.591" (15.00mm), Amplada: 0.504" (12.80mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 1.378" (35.00mm), Amplada: 0.728" (18.50mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Bolt On, Forma: Square, Pin Fins, Llargada: 0.984" (25.00mm), Amplada: 0.984" (25.00mm),
