Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 1.450" (36.83mm), Amplada: 0.700" (17.78mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Bolt On and PC Pin, Forma: Square, Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and Board Mounts, Forma: Rectangular, Fins, Llargada: 1.340" (34.04mm), Amplada: 1.000" (25.40mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.335" (8.50mm), Amplada: 0.335" (8.50mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.472" (12.00mm), Amplada: 0.472" (12.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Press Fit, Forma: Square, Pin Fins, Llargada: 0.984" (25.00mm), Amplada: 0.984" (25.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: SOT-32, TO-220, TOP-3, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.500" (38.10mm), Amplada: 1.772" (45.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.209" (30.70mm), Amplada: 1.209" (30.70mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Llargada: 1.457" (37.00mm), Amplada: 1.457" (37.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Bolt On and PC Pin, Forma: Square, Pin Fins, Llargada: 1.500" (38.10mm), Amplada: 1.374" (34.90mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 0.550" (13.97mm),
Tipus: Board Level, Vertical, Paquet refrigerat: SOT-32, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 0.591" (15.00mm), Amplada: 0.472" (12.00mm),
Tipus: Top Mount, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.712" (18.08mm), Amplada: 1.000" (25.40mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 0.472" (12.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.984" (25.00mm), Amplada: 0.984" (25.00mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 1.180" (29.97mm), Amplada: 1.000" (25.40mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.700" (17.78mm), Amplada: 1.750" (44.45mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 0.984" (25.00mm), Amplada: 1.181" (30.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.00mm),
Tipus: Top Mount, Paquet refrigerat: TO-263 (D²Pak), Mètode d’adjunt: SMD Pad, Forma: Rectangular, Fins, Llargada: 0.500" (12.70mm), Amplada: 1.031" (26.20mm),
Tipus: Top Mount, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.787" (20.00mm), Amplada: 1.142" (29.00mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 0.750" (19.05mm), Amplada: 0.520" (13.21mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 1.181" (30.00mm), Amplada: 1.260" (32.00mm),
Tipus: Top Mount, Paquet refrigerat: 14-DIP and 16-DIP, Mètode d’adjunt: Press Fit, Forma: Rectangular, Fins, Llargada: 0.250" (6.35mm), Amplada: 0.748" (19.00mm),
Tipus: Board Level, Vertical, Paquet refrigerat: TO-126, Mètode d’adjunt: Press Fit, Slide On, Forma: Rectangular, Fins, Llargada: 0.520" (13.21mm), Amplada: 0.775" (19.68mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 1.457" (37.00mm), Amplada: 1.457" (37.00mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Bolt On and PC Pin, Forma: Square, Fins, Llargada: 1.181" (30.00mm), Amplada: 1.181" (30.00mm),
Tipus: Board Level, Paquet refrigerat: TO-220, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 1.969" (50.00mm), Amplada: 1.181" (30.00mm),
