Dissipadors de calor tèrmics

335714B00000G

Stock Part: 75628

322805B00000G

Stock Part: 31618

Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

342000F00000G

Stock Part: 63

325705R00000G

Stock Part: 43130

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

335214B00000G

Stock Part: 56838

321127B00000G

Stock Part: 135

311505A00000G

Stock Part: 41165

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

335814B00000G

Stock Part: 75805

335314B00032G

Stock Part: 42733

341900F00000G

Stock Part: 108

342947

Stock Part: 2083

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Rectangular, Fins, Llargada: 2.323" (59.00mm), Amplada: 2.280" (57.91mm),

342942

Stock Part: 3036

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.732" (44.00mm), Amplada: 1.772" (45.00mm),

342948

Stock Part: 1727

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 2.717" (69.00mm), Amplada: 2.756" (70.00mm),

342950

Stock Part: 1438

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 3.543" (90.00mm), Amplada: 3.543" (90.00mm),

342941

Stock Part: 2849

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.594" (40.50mm), Amplada: 1.575" (40.00mm),

342943

Stock Part: 2599

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 1.969" (50.00mm), Amplada: 1.969" (50.00mm),

342946

Stock Part: 1791

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 2.362" (60.00mm), Amplada: 2.362" (60.00mm),

342949

Stock Part: 1387

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 3.150" (80.00mm), Amplada: 3.150" (80.00mm),

321527B00000G

Stock Part: 8120

Tipus: Top Mount, Paquet refrigerat: TO-5, TO-39, Mètode d’adjunt: Threaded Coupling, Forma: Cylindrical,

374324B00035G

Stock Part: 2363

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.063" (27.00mm), Amplada: 1.063" (27.00mm),

374724B00032G

Stock Part: 2860

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

375024B00032G

Stock Part: 3412

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.01mm),

320105B00000G

Stock Part: 42417

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

374324B60023G

Stock Part: 3997

Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Solder Anchor,

371824B00032G

Stock Part: 4711

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374924B00032G

Stock Part: 4731

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.01mm),

374624B00032G

Stock Part: 4994

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374724B60024G

Stock Part: 4510

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Solder Anchor, Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

374124B00035G

Stock Part: 4624

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.906" (23.01mm), Amplada: 0.906" (23.01mm),

374424B00035G

Stock Part: 4622

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.063" (27.00mm), Amplada: 1.063" (27.00mm),

374024B00035G

Stock Part: 4801

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.906" (23.01mm), Amplada: 0.906" (23.01mm),

374724B00035G

Stock Part: 5818

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),

335824B00034G

Stock Part: 7060

Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.180" (29.97mm), Amplada: 1.180" (29.97mm),

323005B00000G

Stock Part: 28241

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

311505B00000G

Stock Part: 58810

Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,

375424B00034G

Stock Part: 11836