Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical, Llargada: 0.400" (10.16mm), Amplada: 0.315" (8.00mm) ID,
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Fins, Llargada: 0.655" (16.64mm), Amplada: 0.655" (16.64mm),
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Llargada: 0.790" (20.07mm), Amplada: 0.790" (20.07mm),
Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Bolt On, Forma: Cylindrical,
Tipus: Board Level, Paquet refrigerat: TO-5, Mètode d’adjunt: Press Fit, Forma: Cylindrical,
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Llargada: 0.985" (25.02mm), Amplada: 0.985" (25.02mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Rectangular, Fins, Llargada: 1.480" (37.59mm), Amplada: 1.516" (38.50mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Push Pin, Forma: Square, Fins, Llargada: 2.362" (60.00mm), Amplada: 2.362" (60.00mm),
Tipus: Top Mount, Paquet refrigerat: TO-5, Mètode d’adjunt: Threaded Coupling, Forma: Cylindrical,
