Tipus: Board Level, Vertical, Paquet refrigerat: TO-220, TO-218, Mètode d’adjunt: Bolt On, Forma: Rectangular, Fins, Llargada: 1.500" (38.10mm), Amplada: 0.640" (16.26mm),
Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.750" (44.45mm), Amplada: 1.700" (43.18mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Adhesive, Forma: Square, Pin Fins, Llargada: 0.984" (25.00mm), Amplada: 0.984" (25.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),
Tipus: Top Mount, Paquet refrigerat: BGA, Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 1.378" (35.00mm), Amplada: 1.378" (35.00mm),