Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, General Purpose, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.1" (2.54mm) Grid, Patró del circuit: Pad Per Hole (Round), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.050" (1.27mm), Diàmetre del forat: 0.025" (0.64mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, General Purpose, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Patró del circuit: Pad Per Hole (Round), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, General Purpose, Revestiment: Plated Through Hole (PTH), Brea: 0.100" (2.54mm), Patró del circuit: Pad Per Hole (Round), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, General Purpose, Revestiment: Plated Through Hole (PTH), Brea: 0.100" (2.54mm), Patró del circuit: Pad Per Hole (Round), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.156" (3.96mm), Diàmetre del forat: 0.067" (1.70mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),
Tipus de tauler proto: Breadboard, Prepunched Insulating, Revestiment: Non-Plated Through Hole (NPTH), Brea: 0.100" (2.54mm), Diàmetre del forat: 0.042" (1.07mm),