Dissipadors de calor tèrmics

APR33-33-12CB/M

Stock Part: 6030

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Clip, Forma: Square, Pin Fins, Llargada: 1.283" (32.60mm), Amplada: 1.283" (32.60mm),

APR38-38-12CB/T

Stock Part: 6033

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Clip, Forma: Square, Pin Fins, Llargada: 1.461" (37.10mm), Amplada: 1.461" (37.10mm),

BDN09-3CB/A01

Stock Part: 31224

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 0.910" (23.11mm), Amplada: 0.910" (23.11mm),

BDN10-5CB/A01

Stock Part: 45852

BDN15-3CB/A01

Stock Part: 37650

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.510" (38.35mm), Amplada: 1.510" (38.35mm),

BDN12-5CB/A01

Stock Part: 26877

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.210" (30.73mm), Amplada: 1.210" (30.73mm),

BDN16-3CB/A01

Stock Part: 16237

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.610" (40.89mm), Amplada: 1.610" (40.89mm),

BDN12-3CB/A01

Stock Part: 28027

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.210" (30.73mm), Amplada: 1.210" (30.73mm),

BDN18-6CB/A01

Stock Part: 18703

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.810" (45.97mm), Amplada: 1.810" (45.97mm),

BDN17-3CB/A01

Stock Part: 24023

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.710" (43.43mm), Amplada: 1.710" (43.43mm),

BDN14-3CB/A01

Stock Part: 28091

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.410" (35.81mm), Amplada: 1.410" (35.81mm),

BDN18-3CB/A01

Stock Part: 18333

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.810" (45.97mm), Amplada: 1.810" (45.97mm),

BDN09-3CB

Stock Part: 43083

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Not Included), Forma: Square, Pin Fins, Llargada: 0.910" (23.11mm), Amplada: 0.910" (23.11mm),

BDN13-3CB/A01

Stock Part: 25347

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.310" (33.27mm), Amplada: 1.310" (33.27mm),

BDN11-3CB/A01

Stock Part: 25975

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.110" (28.19mm), Amplada: 1.110" (28.19mm),

BDN10-3CB/A01

Stock Part: 31662

Tipus: Top Mount, Paquet refrigerat: Assorted (BGA, LGA, CPU, ASIC...), Mètode d’adjunt: Thermal Tape, Adhesive (Included), Forma: Square, Pin Fins, Llargada: 1.010" (25.65mm), Amplada: 1.010" (25.65mm),

LAT0127B2CB

Stock Part: 6139

Tipus: Board Level, Paquet refrigerat: TO-127, TO-220, Mètode d’adjunt: Bolt On, Forma: Rhombus, Llargada: 1.630" (41.40mm), Amplada: 1.290" (32.77mm),

TXP0508B

Stock Part: 2429

LA363B3CB

Stock Part: 6143

Tipus: Board Level, Paquet refrigerat: TO-3, Mètode d’adjunt: Bolt On, Forma: Rhombus, Llargada: 1.630" (41.40mm), Amplada: 1.290" (32.77mm),

PSD1-1-CB

Stock Part: 6104

Tipus: Board Level, Vertical, Mètode d’adjunt: Bolt On and PC Pin, Forma: Rectangular, Fins, Llargada: 2.180" (55.37mm), Amplada: 1.380" (35.05mm),

FHL31-31-17/T710/T

Stock Part: 1941

Tipus: Board Level, Mètode d’adjunt: Clip, Tape, Forma: Square, Fins, Llargada: 1.220" (30.99mm), Amplada: 1.220" (30.99mm),

FXE827269T710

Stock Part: 6236

TX30547R

Stock Part: 4050

TX1822ND

Stock Part: 1560

TX0547B

Stock Part: 3746

HP3-TO3-CB

Stock Part: 6170

Tipus: Board Level, Paquet refrigerat: TO-3, Mètode d’adjunt: Bolt On, Forma: Square, Pin Fins, Llargada: 3.120" (79.25mm), Amplada: 3.120" (79.25mm),

LATO3B5B

Stock Part: 6195

RUR6712U

Stock Part: 6221

Tipus: Board Level, Vertical, Mètode d’adjunt: Bolt On and Clip, Forma: Rectangular, Llargada: 0.113" (2.87mm), Amplada: 0.530" (13.46mm),

FEX40-40-21/T710/M2

Stock Part: 2437

Tipus: Board Level, Mètode d’adjunt: Clip, Tape, Forma: Square, Fins, Llargada: 1.575" (40.00mm), Amplada: 1.575" (40.00mm),

RU67B1B

Stock Part: 6136

Paquet refrigerat: TO-92, Mètode d’adjunt: Press Fit,

TX1822B

Stock Part: 2322

TXP050822B

Stock Part: 2302

TXB2P050037B

Stock Part: 4114

LAE66A3CB

Stock Part: 31599

Tipus: Board Level, Paquet refrigerat: TO-126, TO-220, Mètode d’adjunt: Bolt On, Forma: Rhombus, Llargada: 1.310" (33.27mm), Amplada: 0.900" (22.86mm),

LA363B4CB

Stock Part: 6129

Tipus: Board Level, Paquet refrigerat: TO-3, Mètode d’adjunt: Bolt On, Forma: Rhombus, Llargada: 1.630" (41.40mm), Amplada: 1.290" (32.77mm),

LATO3B4B

Stock Part: 9624